W4X4.16C

4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)

Packaging Details

Typical Weight (gm)
NA
Pin Count
16
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
2.16
Length (MM)
2.16
Max Height (MM)
0.66
Pitch (MM)
0.50
Family
WLCSP-TCURDL
Body Thickness (MM)
0.60