W4X4.16B

4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)

Packaging Details

Typical Weight (gm)
0.0034
Pin Count
16
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.66
Length (MM)
1.66
Max Height (MM)
*
Pitch (MM)
*
Family
*
Body Thickness (MM)
*
* : Multiple values, See package outline drawing.