W3X5.15

15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)

Packaging Details

Typical Weight (gm)
0.0031
Pin Count
15
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.51
Length (MM)
2.15
Max Height (MM)
*
Pitch (MM)
*
Family
WLCSP-TKCURDL
Body Thickness (MM)
*
* : Multiple values, See package outline drawing.