W3X4.12B

12 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Packaging Details

Typical Weight (gm)
NA
Pin Count
12
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.29
Length (MM)
1.69
Max Height (MM)
0.55
Pitch (MM)
0.40
Family
WLCSP-BP
Body Thickness (MM)
0.50