W3X4.12A

3x4 Array 12 Balls With 0.40 Pitch Wafer Level Chip Scale Package (WLCSP) (BSC)

Packaging Details

Typical Weight (gm)
0.0040
Pin Count
12
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.39
Length (MM)
1.69
Max Height (MM)
0.02
Pitch (MM)
0.02
Family
WLCSP-BPBC
Body Thickness (MM)
0.01