W3X4.12

3x4 Array 12 Ball Wafer Level Chip Scale Package (WLCSP)

Packaging Details

Typical Weight (gm)
NA
Pin Count
12
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.30
Length (MM)
1.70
Max Height (MM)
0.55
Pitch (MM)
0.40
Family
WLCSP-BP
Body Thickness (MM)
0.31