W3X3.9H

9 Ball 3x3 Array Ultra Thin Wafer Level Chip Scale Package (WLCSP) 0.4mm Pitch

Packaging Details

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Documents
Typical Weight (gm)
NA
Pin Count
9
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.45
Length (MM)
1.45
Max Height (MM)
0.32
Pitch (MM)
0.40
Family
WLCSP-BP
Body Thickness (MM)
0.28