W3X3.9B

3x3 Array 9 Ball Wafer Level Chip Scale Package (Intersil Standard)

Packaging Details

Typical Weight (gm)
NA
Pin Count
9
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.50
Length (MM)
1.50
Max Height (MM)
0.65
Pitch (MM)
0.50
Family
WLCSP-BP
Body Thickness (MM)
0.36