W3X2.6

3x2 Array 6 Ball Wafer Level Chip Scale Package (WLSCP 0.4mm Pitch)

Packaging Details

Documents
Typical Weight (gm)
0.00168
Pin Count
6
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
1.36
Length (MM)
0.80
Max Height (MM)
0.55
Pitch (MM)
0.40
Family
WLCSP-BP
Body Thickness (MM)
NA