W13X13.169

169 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Packaging Details

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Typical Weight (gm)
NA
Pin Count
169
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
5.61
Length (MM)
5.61
Max Height (MM)
0.55
Pitch (MM)
0.40
Family
WLCSP-TKCURDL
Body Thickness (MM)
0.50