W11X11.121

121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm Pitch)

Packaging Details

Documents
Typical Weight (gm)
NA
Pin Count
121
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
5.46
Length (MM)
5.46
Max Height (MM)
0.66
Pitch (MM)
0.50
Family
WLCSP-TCURDL
Body Thickness (MM)
0.36