M24.173C

24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Packaging Details

Typical Weight (gm)
0.09
Pin Count
24
Peak Temp (°C)
240
Lead Free Peak Temp (°C)
260
Width (MM)
*
Length (MM)
7.80
Max Height (MM)
1.05
Pitch (MM)
0.65
Family
TSSOP-EP
Body Thickness (MM)
NA
* : See package outline drawing.