S3X3.9

3x3 Array 9 Bump Optical Chip Scale Package (OCSP)

Packaging Details

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Typical Weight (gm)
0.00924
Pin Count
9
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
250
Width (MM)
2.16
Length (MM)
2.16
Max Height (MM)
1.05
Pitch (MM)
0.65
Family
CSP
Body Thickness (MM)
NA