V409.18X18

409 Low Profile Fine Pitch Plastic Ball Grid Array Package (LFBGA)

Packaging Details

Documents
Typical Weight (gm)
0.644
Pin Count
409
Peak Temp (°C)
235
Lead Free Peak Temp (°C)
260
Width (MM)
*
Length (MM)
*
Max Height (MM)
1.40
Pitch (MM)
0.80
Family
LBGA
Body Thickness (MM)
NA
* : See package outline drawing.