V356.27X27C

356 Ball Heatsink Plastic Ball Grid Array Package (HPBGA)

Packaging Details

Documents
Typical Weight (gm)
2.61
Pin Count
356
Peak Temp (°C)
NA
Lead Free Peak Temp (°C)
260
Width (MM)
27.00
Length (MM)
27.00
Max Height (MM)
NA
Pitch (MM)
1.27
Family
HBGA
Body Thickness (MM)
NA