V35.4.7X6.3

35 Thin Profile Ball Grid Array Package (TFBGA)

Packaging Details

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Typical Weight (gm)
NA
Pin Count
35
Peak Temp (°C)
235
Lead Free Peak Temp (°C)
260
Width (MM)
4.70
Length (MM)
6.30
Max Height (MM)
1.15
Pitch (MM)
0.80
Family
TFBGA
Body Thickness (MM)
1.04