V172.8X8

172 Thin, Fine Pitch Ball Grid Array Package

Packaging Details

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Typical Weight (gm)
0.095
Pin Count
172
Peak Temp (°C)
235
Lead Free Peak Temp (°C)
260
Width (MM)
8.00
Length (MM)
8.00
Max Height (MM)
*
Pitch (MM)
0.50
Family
TFBGA
Body Thickness (MM)
1.20
* : See package outline drawing.