| TEST |
MIL-STD-883
TEST METHOD |
CLASS
T |
CLASS
Q |
CLASS
V |
Wafer Lot Acceptance
(Note 1) |
PM Electrical Samples
(Note 2) |
Yes |
Yes |
Yes |
| Nondestructive Bond Pull |
2023 or Approved Alternate |
- |
- |
Yes |
| Internal Visual |
2010 SOS/SCD Compliant
Grandfathered Material |
Yes |
Yes |
Yes |
| Temperature Cycling |
1010 |
- |
Yes |
Yes |
| Constant Acceleration |
2001 |
- |
Yes |
Yes |
| PIND |
2020 |
- |
|
Yes |
| Serialization |
In accordance with Device
Procurement Specifications |
- |
Yes |
Yes |
| Radiographic Inspection |
2012 |
- |
|
Yes |
| Interim (Pre Burn-In) Electrical
Parameters |
In accordance with Device
Procurement Specifications |
Yes |
Yes |
Yes |
| Burn-In Test (DC) |
1015 |
Yes |
Yes |
Yes |
| Interim (Post Burn-In)
Electrical Parameters |
In accordance with Device
Procurement Specifications |
- |
Yes |
Yes |
| Reverse Bias Burn-In (Dynamic) |
1015 |
- |
|
Yes |
| Interim (Post Burn-In)
Electrical Parameters |
In accordance with Device
Procurement Specifications |
- |
Yes |
Yes |
Percent Defective Allowable
(PDA)
Calculation |
All Lots or as Required by
Device Procurement Specifications |
- |
Yes |
Yes |
| Final Electrical Test |
In accordance with Device
Procurement Specifications |
Yes |
Yes |
Yes |
| Seal (Fine and Gross) |
1014 |
Yes |
Yes |
Yes |
| External Visual |
2009 |
Yes |
Yes |
Yes |
- Product that does not meet step coverage requirements per MIL-STD-883, Method 2018 will
be evaluated for minimum metal thickness requirements using the following criteria:
- Current Density of 2E5 A/CM2
- Electromigration rules for the applicable technology
- A minimum thickness of 2000A for mechanical integrity
- The thickest metal requirement calculated to meet the appropriate metal thickness will
be used as the acceptance criteria for step coverage.
- Class V test method 5007 plus PM Electrical Samples, Class Q
uses PM Electrical Samples only.
|
