The price listed is the manufacturer's suggested retail price for quantities of 1K units. However, prices in today's market are fluid and may change without notice.
MSL = Moisture Sensitivity Level - per IPC/JEDEC J-STD-020
SMD = Standard Microcircuit Drawing
Description
The RSLIC-VoIP family of ringing subscriber line interface circuits (RSLIC) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline applications. Ideally suited for remote subscriber units, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements.
The RSLIC-VoIP family operates to 100V which translates directly to the amount of ringing voltage supplied to the end subscriber. With the high operating voltage, subscriber loop lengths can be extended to 500Ω (i.e., 5,000 feet) and beyond.
Other key features across the product family include: low power consumption, ringing using sinusoidal or trapezoidal waveforms, robust auto-detection mechanisms for when subscribers go on or off hook, and minimal external discrete application components. Integrated test access features are also offered on selected products to support loopback testing as well as line measurement tests.
There are five product offerings of the HC55185 with each version providing voltage grades of high battery voltage and longitudinal balance. The voltage feed amplifier design uses low fixed loop gains to achieve high analog performance with low susceptibility to system induced noise.
Key Features
Onboard Ringing Generation
Compatible with Existing HC5518x Devices
Low Standby Power Consumption (75V, 65mW)
Reduced Idle Channel Noise
Programmable Transient Current Limit
Improved Off Hook Software Interface
Integrated MTU DC Characteristics
Low External Component Count
Silent Polarity Reversal
Pulse Metering and On Hook Transmission
Tip Open Ground Start Operation
Balanced and Unbalanced Ringing
Thermal Shutdown with Alarm Indicator
28 Lead Surface Mount Packaging
Reduced Footprint Micro Leadframe Packaging
Dielectric Isolated (DI) High Voltage Design
QFN Package Option
Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Product Outline
Near Chip Scale Package Footprint; Improves PCB efficiency and has a thinner profile
Application Note(s):
Evaluation Board(s):
Technical Homepage: