SOIC
ICP Data Analysis Report
Lead Frame Material
A42
A151
A194
C194
C7025
EFTEC64T
CDA194
Die Attach Material
Adhesive2200D
Adhesive8200T
Ablebond 8290
Ablebond 84-1LMISR4
CRM-1085A
Bond Wire
Gold Wire
Mold Material
EME-6300
EME-6600
G600
G605
Lead Finish Plating
Tin
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