D
QFN MODULE
ICP Data Analysis REACH Report
CYNTEC
Silicon Wafer
Lead Frame
Silicon Wafer
C19210
Ag Plating
Bond Wire
Gold Wire
Mold Material
EG100
Lead Finish Plating
Tin
Tin
Halogen
Schottky Diode
Diode Chip
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Thin Film Chip
Capacitors
MLCC
PCB
Copper Foil
Choke
Power Choke
Underfill
Suf1570-2
Solder
Solder Paste
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