• Matte Tin is rapidly becoming a world wide Pb-Free finish of choice
  • Fully compatible with both Pb-Free and Pb based solders used at the customer PCB assembly level.
  • Favorable cost and simplified processing compared to SnBi, NiPdAu or other alternative Pb-Free finishes

Step 2: Qualification of new halogen free (GREEN) mold compounds and die attach epoxies and the classification of moisture sensitivity level (MSL) for 260°C re-flow of all lead-frame surface mount packages by package and process technology. This step will provide customers with information on dry pack requirements for Pb-Free packages as higher re-flow temperatures are used for Pb-Free circuit board assembly. Intersil has qualified all SOIC, SOP, SOT, QFN, L/TQFP and BGA packages. Due to volume and older package technology styling, there are no generic plans to offer Pb-Free PDIP, SIP, PSOP, PLCC or MQFP package components with Pb-Free/Green material set, however, special considerations for packaged products that have not been planned for release as Pb-Free will be taken on case-by-case basis.

Step 3: Release to production Green/Pb-Free compliant device types using a special Green/Pb-Free finished good part number. In general, the new Green/Pb-Free part numbers for these device types will include a "Z" or "ZA" suffix at the end of the standard part number. Devices that are Pb-Free will be marked as such on all packaging boxes with the following label:

Also, Green/Pb-Free devices will be marked with a "Z" on the device to denote Green/Pb-Free compliance. For those package styles such as SOT-23 and SC-70 that are to small to support additional device character marking, Intersil will use a special code assigned within the current part naming convention.

Step 4: Improve and enhance Pb-Free MSL performance of Green/Pb-Free components. This is a continuous improvement effort involving selection of improved materials of construction and assembly processes. This task will be ongoing.