Table
I
Pb-Free Reflow Profile
|
| Profile
Feature |
Pb
Free Assembly
Small Body |
Average ramp-up rate
(TL to Tp) |
3°C/sec max. |
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts) |
150°C
200°C
60-180 seconds |
Tsmax to TL
– Ramp-up Rate |
3°C/sec max. |
Time Maintained above
– Temperature (TL)
– Time (tI) |
217°C
60-150 seconds |
| Peak Temperature |
See Table II |
Time within 5°C of actual Peak
Temperature (tp) |
20-40 seconds |
| Ramp-down Rate |
6°C /second max. |
| Time 25°C to Peak Temperature |
8 minutes max |
|
| Note: peak Reflow temperatures
based on soon to be released J-STD020C. For
purposes of qualification Intersil used 260ºC
for all packages |
|
|
|
|
Table
II
Pb Free Process-Package Peak Reflow Temperature
|
Package Thickness |
Pkg.
Volume
<350 mm3 |
Pkg.
Volume
350 - 2000 mm3 |
Pkg
Volume
>2000 mm3 |
| < 1.6 mm |
260ºC |
260ºC |
260ºC |
| 1.6 - 2.5 mm |
260ºC |
250ºC |
245ºC |
| > 2.5 mm |
250ºC |
245ºC |
245ºC |
|
| Note: Devices shall be process
compatible up to and including the stated
classification temperature at the rated MSL
level. For moisture sensitivity devices using
the lowest possible maximum Reflow temperature,
which provides proper Reflow of solder, is
preferred. |
|
|
|
|
Table III
Moisture Sensitivity Floor Life
|
Level |
Floor
Life |
| Time |
Conditions |
| 1 |
Unlimited |
<30ºC/85% RH |
| 2 |
1 year |
<30ºC/60% RH |
| 2a |
4 weeks |
<30ºC/60% RH |
| 3 |
168 hours |
<30ºC/60% RH |
| 4 |
72 hours |
<30ºC/60% RH |
| 5 |
48 hours |
<30ºC/60% RH |
| 5a |
24 hours |
<30ºC/60% RH |
| 6 |
Time on label |
<30ºC/60% RH |
|
|
|
|
|
