For ordering information and product
status please contact your local Intersil sales
representative.
Intersil, a leader in environmental-friendly, high
performance analog solutions, now offers an extensive
portfolio of "Pb-Free and Green" integrated
circuits. This Web page allows the user to view details
on the industry move to Pb-Free electronics as well as
the Intersil Green/Pb-Free initiatives and strategies.
For Green/Pb-Free current product availability see the Intersil
Green/Pb-Free Parts List.
Demand for Pb-Free and Green Products
Due to environmental concerns in the European Union and
around the world, the need for Pb-Free solutions in
electronic components and systems is receiving
increasing attention within the semiconductor and
electronics industries.
Intersil looks forward to working with our customers to
provide you with the most cost-effective and reliable
Green/Pb-Free
product solution for your needs.
Intersil is currently considering approaches that would
help to discontinue the use of Pb and other restricted
substances in our products as well as in the
manufacturing processes of our customers. Integration
issues of electronics design require that Pb-Free
solutions must be driven across the supply chain.
Intersil's Response
Currently Intersil is an active participant in several
industry consortia addressing Pb-Free processing. These
groups are evaluating Pb-Free solder alloys with Pb-Free
components and printed wiring board finishes. Several of
the Pb-Free solder alloys being proposed require a
maximum Reflow temperature that is higher than the
current peak temperature of 220-235°C for Sn/Pb.
Impact of Higher Peak Reflow Temperatures
One major impact on the component packaging will be the
higher peak Reflow temperature required for Pb-Free
assembly, with 260°C often mentioned as the upper
target. The high temperature ensures that all the
components on a fully populated board will reach the
melting temperature of the Pb-Free solder. Many plastic
packages will have difficulty meeting such a constraint
at JEDEC-defined moisture sensitivity levels 1 and 2.
Currently, certain small packages such as SOP (Small
Outline Packages) and TSSOP (Thin Shrink Small Outline
Packages) can withstand the thermal strain without
suffering from interfacial delamination, popcorn-induced
cracking, or warping. However, larger packages will not
meet this requirement. Their JEDEC moisture sensitivity
level classification could be downgraded by as many as
two levels.
A summary of Moisture Sensitivity Levels (MSLs) is
provided at Intersil's Generic
Pb-Free Moisture Sensitivity Levels page.
Intersil's Commitment
Intersil strives to minimize the amount of disruption
that might be associated with the procurement and use of
Pb-Free products.
Intersil is committed to meeting the needs of our customers
and continuing to provide the best products, coupled
with the best service in the industry.
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