Applications

Rad Hard SMD Test Flow

Test MIL-STD-883
Test Method
Class T Class Q Class V
Wafer Lot Acceptance (Note 1) PM Electrical Samples (Note 2) Yes Yes Yes
Nondestructive Bond Pull 2023 or Approved Alternate - - Yes
Internal Visual 2010 or Approved Alternate Yes Yes Yes
Temperature Cycling 1010 - Yes Yes
Constant Acceleration 2001 - Yes Yes
PIND 2020 - - Yes
Serialization In accordance with Device Procurement Specifications - Yes Yes
Radiographic Inspection 2012 - - Yes
Interim (Pre Burn-In) Electrical Parameters In accordance with Device Procurement Specifications Yes Yes Yes
Burn-In Test (DC) 1015 Yes Yes Yes
Interim (Post Burn-In) Electrical Parameters In accordance with Device Procurement Specifications - Yes Yes
Reverse Bias Burn-In 1015 - - Yes
Interim (Post Burn-In) Electrical Parameters In accordance with Device Procurement Specifications - Yes Yes
Percent Defective Allowable (PDA) Calculation All Lots or as Required by Device Procurement Specifications - Yes Yes
Final Electrical Test In accordance with Device Procurement Specifications Yes Yes Yes
Seal (Fine and Gross) 1014 Yes Yes Yes
External Visual 2009 Yes Yes Yes
  1. This is a general Overview for Intersil QML, Class V, Class Q and Class T. For part specific flow details, please contact your Local Intersil Sales office or Representative in your area.
  2. Product that does not meet step coverage requirements per MIL-STD-883, Method 2018 will be evaluated for minimum Metal Thickness requirements using the following criteria:
    • Current Density of 2E5 A/CM2
    • Electromigration rules for the applicable technology
    • A minimum thickness of 2000A for mechanical integrity
    • The thickest metal requirement calculated to meet the appropriate metal thickness will be used as the acceptance criteria for step coverage.
  3. Class V test method 5007 plus PM Electrical Samples, Class Q uses PM Electrical Samples only.

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