Operations & Technology
Customer Confidence with “Asset-Lite” Operations
In today’s volatile business environment, it’s difficult to efficiently manage a technology-driven supply chain. With Intersil’s manufacturing prowess, customers can eliminate fears of unforeseen production disruptions and discover how Intersil can deliver exceptional service.
Intersil’s Solution
At Intersil, our “asset-lite” operations strategy is based on strategic partnering with a globally distributed network of best-in-class, foundry assembly/test manufacturing partners. This minimizes the impact of regional production disruptions, resulting in a more predictable supply chain. The asset-lite program is based on three key strategic drivers:
- Strong Technology Development Team: Continuous development of proprietary process and package technologies utilizing both internal manufacturing and external partners to enable differentiated products.
- Multi-Sourcing Strategy: Sourcing >80% of Intersil’s products from multiple, leading edge semiconductor foundries and assembly/test partners provides the assured supply required to manage supply risks, costs and meet our customer’s needs.
- Industry-Leading Quality & Reliability Metrics: Disciplined focus on new product introductions and manufacturing systems across all product families, foundries and assembly/test partners together with our decades of experience handling military/space products has enabled our quality and reliability metrics to achieve world-class standards.
Asset-Lite Manufacturing: Lower Risk, Higher Confidence
Utilizing both internal and external manufacturing, Intersil has pioneered the analog "asset-lite" model. As shown below, only Intersil’s asset-lite model provides customers with the combination of leading edge technology, high quality product, on-time delivery and lower customer risk through assured supply.
True Global Support
In addition to our 20 manufacturing sites in nine countries, Intersil has a complete global support network of 44 design and sales/support offices in 17 countries. Such a diversified asset-lite analog manufacturing model is enabling a scalable, cost-effective supply chain that is continually optimized for capacity, service and lower customer risk.
Intersil’s Quality Policy
Intersil focuses on continuous improvement, and strives to deliver products and services that meet or exceed our customer's requirements and expectations. Intersil achieves world class product quality levels by driving quality initiatives throughout the entire product cycle from product development, manufacturing to customer support.
Third Party Certifications
Quick Links
Publications
- Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)
- Guidelines for Soldering Surface Mount Components to PC Boards
- Decreasing Moisture Content of Epoxy
- Calculation of Semiconductor Failure Rates
- Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications
- Use of Life Tested Parts
High performance ICs result from the synergistic combination of three essential elements: architecture, wafer fabrication and assembly. All three must work together to create leading-edge ICs.
Architecture
Whether you’re creating a building, an airplane or an integrated circuit, a product’s usefulness is determined by the functional elements and how they are interconnected. Intersil has developed a huge and rapidly growing portfolio of high-performance functional blocks that are interconnected to create ICs. We’re constantly pushing the envelope with new circuit designs and innovative architectures.
Wafer Fabrication
Creating high-performance ICs requires optimized wafer fabrication technologies. With Intersil’s asset-lite strategy, we use our own wafer fab in Palm Bay, Florida, to create specialized ICs for rad-hard and high voltage applications. Most other ICs are fabricated using proprietary processes at several wafer foundry partners. State-of-the-art wafer fab processes, selected to match each products’ requirements, are essential to creating leading-edge ICs.
Assembly
Today’s products demand increasing density – packing advanced new functions into smaller and smaller spaces. This increasingly requires three-dimensional combinations of multiple ICs in a very small package. At the same time, increasing amounts of power must be delivered and heat removed from tiny IC packages. Intersil is accelerating the pace of innovation in IC assembly to meet our customers' rapidly evolving needs.
