Plastic Packages 
Hermetic Packages 
Elantec Packages 
Tech Briefs

 
 
 
  • Elantec Packages
    • MDP0027 SO Small Outline Package Family
    • MDP0031 PDIP Plastic Dual Inline Package
    • MDP0038 SOT-23 Package Family
    • MDP0040 QSOP 0.150" Narrow Body Package
    • MDP0042 HSOP Heatsink SO Package, Slug-Down, 2 Mil Stand-Off
    • MDP0043 MSOP Mini SO Package Family
    • MDP0044 TSSOP Thin-Shrink Small Outline Package Family
    • MDP0046 QFN (Quad Flat No-Lead) Package Family (Formerly Known as LPP)
    • MDP0047 Dual Flat No-Lead (DFN) Package Family
    • MDP0048 HTSSOP Heatsink TSSOP Package Family
    • MDP0049 TSOT Package Family
    • MDP0050 HMSOP (Heat-Sink MSOP)
    • MDP0051 TQFN (Thin Quad Flat No-Lead) Package Family
    • MDP0052 ODFN (Optical Dual Flat No-Lead) Package
    • MDP0054 3x2 CSP Package Outline Drawing
    • MDP0055 14 x 20 mm 128 Lead MQFP with Heat Spreader , 3.2 mm Footprint
 
  • Tech Briefs
    • TB52 — Electrostatic Discharge Control: A Guide to Handling Integrated Circuits
    • TB334 — Guidelines for Soldering Surface Mount Components to PC Boards
    • TB347 — Tape and Reel Specification for Integrated Circuits
    • TB363  — Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)
    • TB379 — Thermal Characterization of Packaged Semiconductor Devices

    • TB389 — PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages

    • TB451 — PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices 

    • TB466 — Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead (ODFN) Package

    • AN1085 — Thermal Considerations of the SO-8

    • TB477 — Surface Mount Assembly Guidelines for Optical Dual Flat Pack No Lead (ODFN) Package
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