Packaging Information
W5X5.25B — 5x5 Array 25 Ball With 0.40 Pitch Wafer Level Chip Scale Package (WLCSP)

Documents

Package Outline Drawing (POD) (114 kB)

Typical Weight (gm)	0.0043
Pin Count	25
Peak Temp (°C)	NA
Lead Free Peak Temp (°C)	260
Width (MM)	2.15
Length (MM)	2.17
Max Height (MM)	NA
Pitch (MM)	NA
Family	WLCSP
Body Thickness (MM)	NA

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