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X9250, X9258, X9400, X9401, X9408, X9409
X9250, X9258, X9400, X9401, X9408, X9409

Feb 28 2000
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News & Events
Xicor Announces Chip-Scale Packaging for Digitally Controlled Potentiometer (XDCP) Products

-- True "die size" packaging for volume constrained applications


Milpitas, California, February 28, 2000 - Xicor today announced the availability of digitally controlled potentiometers (XDCP™s) in Xicor's ball grid array (XBGA) chip-scale packaging. Initial XDCP products to be released in XBGA packaging include the X9250, X9258, X9400, X9401, X9408 and X9409. XBGA packaging technology is true "die-size" packaging technology, and reduces the footprint for XDCP products by more than 50% from conventional plastic packages.

The small footprint devices give engineers extra board space and functionality, while shrinking both the size and cost of their end products. XDCP products in XBGA packages are ideal for volume constrained applications such as fiber optic modules, handheld information appliances, and cellular base stations where physical space available is severely constrained. XDCP products in XBGA packaging are only available in tape and reel.

"Xicor has been a pioneer in developing products that incorporate chip-scale packaging technology," said Paul Standish, director of mixed signal products. "The XBGA technology has been in high volume production for more than a year. We are now bringing the benefits of this technology - minimum area and volume for a given die size - to XDCP products."

"This advanced packaging technology represents another step in Xicor's ongoing leadership in XDCP products," continued Standish. "We are the market leader, with the broadest range of products. From 16 to 256 taps, single or dual supply, single, dual or quad products, we offer the best solution for any customer requirement."

XBGAs offer a robust packaging technology without lead frames, plastic molding or other limitations of traditional plastic packaging. Hard glass and epoxy form a seal to protect the die while delivering reliable performance equivalent to standard plastic packaging. Moreover, XBGA packaging technology is entirely compatible with industry standard surface mount assembly equipment and processes.

XDCPs utilize Xicor's industry leading EEPROM technology to implement a low cost variable resistance with a digital serial interface for programming. These devices allow low cost and efficient space control of system analog parameters with standard digital interfaces. Availability of these devices in XBGA packaging allows system control functions to be packaged in much less space than required by conventional surface mount packages.

Availability

Part Number  Samples  Production
X9401WZ24T1  Now Now
X9401WZ24I-2.7T1  Now  Now
X9401YZ24T1  Now  Now
X9401YZ24I-2.7T1  Now  Now
X9409WZ24T1  Now  Now
X9409WZ24I-2.7T1  Now  Now
X9409YZ24T1  Now  Now
X9409YZ24I-2.7TI  Now  Now
X9250UZ24T1  April 15, 2000  Q2
X9250UZ24I-2.7T1  April 15, 2000  Q2
X9250TZ24T1  April 15, 2000  Q2
X9250TZ24I-2.7T1  April 15, 2000  Q2
X9258UZ24T1  April 15, 2000  Q2
X9258UZ24I-2.7T1  April 15, 2000  Q2
X9258TZ24T1  April 15, 2000  Q2
X9258TZ24I-2.7T1  April 15, 2000  Q2
X9400WZ24T1  Q2  Q2
X9400WZ24I-2.7T1  Q2  Q2
X9400YZ24T1  Q2  Q2
X9400YZ24I-2.7T1  Q2  Q2
X9408WZ24T1  Q2  Q2
X9408WZ24I-2.7T1  Q2  Q2
X9408YZ24T1  Q2  Q2
X9408YZ24I-2.7T1  Q2  Q2


All XBGA devices are only available in tape and reel packaging with quantities starting at 10,000 pieces.

Reader Contact
Paul Standish, director, mixed signal products. Xicor, Inc., 1511 Buckeye Drive, Milpitas, CA 95035. Telephone: (408) 546-3492.

Company Background
Xicor, Inc. designs, develops, manufactures and sells nonvolatile in-the-system programmable products which retain information even when the system is turned off or power is inadvertently lost. Xicor's product line includes digitally controlled potentiometers (XDCPs™), system management ICs, and standard and secure memory ICs .

Xicor product, corporate and financial information is readily accessible on the worldwide web at www.xicor.com.

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