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Intersil's PRISM Technology Provides Wi-Fi Capability for Toshiba's New Pocket PC with Embedded WLAN Connectivity

-- Toshiba's e740 Pocket PC is one of the world’s first PDAs with an embedded WLAN solution~-- Intersil's PRISM technology is optimized for small form factor Wi-Fi applications

IRVINE, CA, July 24, 2002 – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high performance analog and wireless networking solutions, today announced that Toshiba's Computer Systems Group (CSG) has integrated Intersil’s PRISM® Wireless Local Area Networking (WLAN) technology into its Toshiba Pocket PC e740. The e740 is one of the world’s first PDAs with built-in Wi-Fi (802.11b) capability, giving it instant data access in WLAN environments.

The Toshiba e740 PDA comes with a bright 64K color display coupled with the powerful new Intel® PXA250 processor with Intel XScale™ technology at 400MHz. Expansion offerings include integrated CompactFlash® II and Secure Digital (SD) media slots and an optional Toshiba Expansion Pack and High Capacity battery. The Toshiba Expansion Pack also integrates a USB port to connect to USB native devices such as a full-size keyboard. The e740 is an ideal companion for Toshiba's full line of wireless-ready consumer and corporate notebook PCs.

“The world is moving to ‘always connected’ mobile devices. The new Toshiba Pocket PC leverages the low power, small form factor and high performance of the industry leading PRISM chip set to enable one of the first handhelds with embedded Wi-Fi connectivity,” said Larry Ciaccia, vice president and general manager for Intersil’s Wireless Networking Product Group. “This first look into a new high volume market of consumer electronic devices with embedded wireless capability emphasizes Intersil’s commitment to lead the WLAN industry well into the future with progressively lower power and lower cost platforms.”

"Toshiba is committed to designing and manufacturing mobile electronic devices that offer the users the ability to stay connected with the information they need by checking e-mail, downloading information or surfing the Internet without the hassle of wires or cables," said Oscar Koenders, vice president of product marketing and worldwide product planning, Toshiba CSG. "Integrating Intersil’s PRISM chip set enabled us to develop and market a Pocket PC that offers portability, ease of use and wireless connectivity.”

Intersil’s IEEE-compliant 802.11b PRISM chip sets are optimized for high data rate (11 Mbps) performance. PRISM-based systems are feature-rich and provide fast, reliable performance in all types of networking environments. Advanced design and process technologies reduce power consumption, design complexity and total system cost. PRISM-based products provide users with wireless access to networks and the Internet for fast and efficient transmission of data, video and Voice over Internet Protocol (VoIP) services.

About Toshiba America Information Systems Inc.
Toshiba Computer Systems Group, a division of Toshiba America Information Systems, Inc. (TAIS), is a leading vendor for portable computers. In addition to notebooks, the company offers portable and wireless accessories, PDAs, and server computing solutions for business customers under the Toshiba brand name. For more information call 1-800-TOSHIBA or visit the company’s Web site at www.csd.toshiba.com. Headquartered in Irvine, Calif., TAIS is comprised of multiple divisions that provide computer, communications and imaging products and services. Products include industry-leading portable computers; PDAs; mobile computing accessories; servers, including communications and portable servers; storage subsystems; cable modems; digital business telephone systems; voice-mail; digital cameras; security systems and projectors. TAIS provides sales, marketing, services and manufacturing for its wide range of information products in the United States and Latin America. TAIS is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, which is a world leader in high technology and integrated manufacturing of electrical and electronic components, products and systems. Toshiba has global sales of over $40 billion and more than 300 subsidiaries and affiliates worldwide.

Intersil + Elantec Means More for Our Customers
Intersil Corporation is a global semiconductor leader in the design and manufacture of high performance analog and wireless networking solutions. The acquisition of Elantec Semiconductor, Inc., expanded Intersil’s product portfolios to address four fast growing markets – flat panel displays, optical storage (CD and DVD recordable), power management, and wireless networking. Intersil brings added customer value in providing complete silicon, software and reference design solutions to new products that enhance the computing experience for people wherever they live, work or travel. For more information about Intersil or to find out how to become a member of our winning team, visit the company's web site and career page at www.intersil.com This press release contains forward-looking statements as defined in Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements are based upon Intersil Corporation’s (“Intersil”) management’s current expectations, estimates, beliefs, assumptions, and projections about Intersil’s business and industry. Words such as “anticipates,” “expects,” “intends,” “plans,” “predicts,” “believes,” “seeks,” “estimates,” “may,” “will,” “should,” “would,” “potential,” “continue,” and variations of these words (or negatives of these words) or similar expressions, are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections, or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to certain risks, uncertainties, and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil’s WLAN product group include, but are not limited to: the slowdown in the technology sector generally and the semiconductor industry specifically; the rate at which consumers adopt small handheld Internet appliances and portable computing devices in enterprises and in homes; the rate at which consumers purchase small handheld Internet appliances, portable computing devices, and notebook computers with embedded wireless; the rate at which our present and future customers and end-users adopt Intersil’s wireless access, technologies; the timing, rescheduling or cancellation of significant customer orders; the ability of our customers to manage inventory; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability and quality of our foundry capacity and raw materials; availability, pricing, and quality of third party foundry and assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party foundries and assembly and test facilities, and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly and test facilities; problems or delays that we may face in shifting our products to smaller geometry process technologies; the effectiveness of Intersil’s expense and product cost control and reduction efforts; the risks inherent in acquisitions, including the acquisition of Elantec Semiconductor, Inc. (including integration issues; costs and unanticipated expenditures; changing relationships with customers, suppliers, and strategic partners; potential contractual, employment, and intellectual property issues; risks of not securing regulatory approvals; accounting treatment and charges; and the risks that the acquisition cannot be completed successfully, or that the anticipated benefits of the acquisition are not realized); intellectual property disputes, customer indemnification claims, and other litigation risks; Intersil’s ability to develop, market, and transition to volume production new products and technologies in a timely manner; the quality of Intersil’s products and any repair or replacement costs; the risks and uncertainties associated with Intersil’s global operations, particularly in light of the war on terrorism; the effects of natural disasters, international conflicts and other events beyond our control; the level of orders received and the ability to fill those orders in a given fiscal quarter; and other factors. Intersil’s Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Intersil filings with the U.S. Securities and Exchange Commission (“SEC”) (which you may obtain for free at the SEC’s web site at www.sec.gov) discuss some of the important risk factors that may affect our business, results of operations, and financial condition. These forward-looking statements are made only as of the date of this communication and Intersil undertakes no obligation to update or revise these forward-looking statements. PRISM is a registered trademark of Intersil Americas Inc.
Intel is a registered trademark and XScale is a trademark of Intel Corporation.
CompactFlash, is a trademark of SanDisk Corporation.
All other trademarks mentioned are the property of their respective owners.