News & Events
Intersil's PRISM Technology Selected by SanDisk for the World's First Combined Flash Memory and 802.11b Wireless Communications Cards

-- Dual-function CF and SDIO cards open new expansion options for customers~-- PRISM chip sets reduce size, cost and provides high performance for new SanDisk cards

MILPITAS, CA, January 28, 2003 – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high performance analog and wireless networking solutions, today announced that SanDisk Corporation (NASDAQ:SNDK), the world's largest supplier of flash data storage products, has designed Intersil’s PRISM® Wireless Local Area Networking (WLAN) chip sets into the new SanDisk Connect™ product line of dual function CompactFlash® (CF) and Secure Digital (SD) cards that skillfully combine both flash memory and 802.11b cards wireless communications technology.

“The combination of SanDisk’s flash data storage products and Intersil’s wireless networking technology will enable a new generation of wireless connectivity in notebooks, PDAs, digital cameras, MP3 players and other small handheld networking appliances,” said Larry Ciaccia, vice president and general manager of Intersil’s Wireless Networking Product Group. These products are indicative of the many new innovative products that are being developed around the PRISM 802.11-based solutions as well as Wi-Fi’s continuous momentum into mainstream applications. This combination, of the leader in flash data storage with the leader in WLAN, has resulted in a very exciting product.”

The SanDisk Connect product line includes four products - dual-function 128-megabyte (MB) CompactFlash and 256MB SD cards that combine Wi-Fi and flash memory as well as single-function CF and SD cards with Wi-Fi connectivity. SanDisk plans to add 256MB cards to the CF Connect product line by the middle of 2003.

“Intersil’s PRISM wireless technology reduces size, complexity and cost of wireless LAN circuitry that enables SanDisk to bring small form factor, competitive wireless solutions to market faster,” said Nelson Chan, SanDisk senior vice president and general manager of SanDisk's retail business unit. “SanDisk is the first to offer a single card with flash memory and Wi-Fi capabilities. We believe SanDisk’s Connect cards meet the needs of a fast growing market that requires storage and wireless connectivity, and we are pleased to team with Intersil to make these products a reality.”

SanDisk's new Connect cards have been designed with low power consumption to minimize battery drain, a key consideration for PDA and notebook users. The CF Connect line can be used in multiple devices because they support both WinCE PDAs and Windows laptops and notebooks. The cards also have been simplified for easy installation, and security encryption keys are included with the products.

Intersil’s 802.11b PRISM chip sets are the most highly integrated WLAN silicon solutions on the market. PRISM chip sets deliver wireless Ethernet networking with compliance to the global standard and are optimized for high data rate (11 Mbps) performance. PRISM-based systems are feature-rich and provide fast, reliable performance in all types of networking environments. Advanced design and process technologies reduce power consumption, design complexity and total system cost.

About SanDisk
SanDisk Corporation the world's largest supplier of flash data storage products, designs, manufactures and markets industry-standard, solid-state data, digital imaging and audio storage products using its patented, high density flash memory and controller technology. SanDisk was founded in 1988 by Eli Harari, an international authority on non-volatile memory technology. The company has optimized its flash memory storage solution, known as "system flash," to address the needs of many emerging applications in the consumer electronics and industrial/communications markets. In November 1995, SanDisk became a publicly traded company (NASDAQ:SNDK). SanDisk, SanDisk is based in Sunnyvale, CA. About Intersil
Intersil Corporation is a global semiconductor leader in the design and manufacture of high performance analog and wireless networking solutions. Intersil’s product portfolios address four fast growing markets – flat panel displays, optical storage (CD and DVD recordable), power management and wireless networking. Intersil brings added customer value in providing complete silicon, software and reference design solutions to new products that enhance the computing experience for people wherever they live, work or travel. For more information about Intersil or to find out how to become a member of our winning team, visit the company's web site and career page at: www.intersil.com

This press release contains forward-looking statements as defined in Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements are based upon Intersil Corporation’s (“Intersil”) management’s current expectations, estimates, beliefs, assumptions, and projections about Intersil’s business and industry. Words such as “anticipates,” “expects,” “intends,” “plans,” “predicts,” “believes,” “seeks,” “estimates,” “may,” “will,” “should,” “would,” “potential,” “continue,” and variations of these words (or negatives of these words) or similar expressions, are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections, or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to certain risks, uncertainties, and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil’s WLAN product group include, but are not limited to: the slowdown in the technology sector generally and the semiconductor industry specifically; our ability to successfully deploy our up integration strategy; the rate at which consumers adopt small handheld Internet appliances and portable computing devices in enterprises and in homes; the rate at which consumers purchase small handheld Internet appliances, portable computing devices, and notebook computers with embedded wireless; the rate at which our present and future customers and end-users adopt Intersil’s wireless access technologies; the timing, rescheduling or cancellation of significant customer orders; the ability of our customers to manage inventory; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability and quality of our foundry capacity and raw materials; availability, pricing, and quality of third party foundry and assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party foundries and assembly and test facilities, and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly and test facilities; problems or delays that we may face in shifting our products to smaller geometry process technologies; the effectiveness of Intersil’s expense and product cost control and reduction efforts; the risks inherent in acquisitions, including the acquisition of Elantec Semiconductor, Inc. (including integration issues; costs and unanticipated expenditures; changing relationships with customers, suppliers, and strategic partners; potential contractual, employment, and intellectual property issues; or that the anticipated benefits of the acquisition are not realized); intellectual property disputes, customer indemnification claims, and other litigation risks; Intersil’s ability to develop, market, and transition to volume production new products and technologies in a timely manner; the quality of Intersil’s products and any repair or replacement costs; the risks and uncertainties associated with Intersil’s global operations, particularly in light of the war on terrorism; the effects of natural disasters, international conflicts and other events beyond our control; the level of orders received and the ability to fill those orders in a given fiscal quarter; and other factors. Intersil’s Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Intersil filings with the U.S. Securities and Exchange Commission (“SEC”) (which you may obtain for free at the SEC’s web site at www.sec.gov) discuss some of the important risk factors that may affect our business, results of operations, and financial condition. These forward-looking statements are made only as of the date of this communication and Intersil undertakes no obligation to update or revise these forward-looking statements. All trademarks mentioned are the property of their respective owners.