News & Events
Intersil’s New MOSFET Driver Package Delivers Superior Thermal Performance in Computers and Internet Appliances

— Enables up to 50 percent thermal resistance reduction and reduces board area in desktop PCs, workstations and file servers

IRVINE, CA, July 14, 2000 — Intersil Corporation (NASDAQ: ISIL), a leading provider of power management solutions for today’s integrated communications applications, today introduced the exposed paddle (E-pad) device package, a thermally-enhanced eight-lead small outline integrated circuit (8L SOIC) that enables power supplies in desktop computers, workstations, file servers and Internet appliances to run cooler and more efficiently.

Designed specifically for Intersil’s recently released family of high-frequency, dual n-channel power metal oxide semiconductor field effect transistor (MOSFET) drivers, the E-Pad features a copper pad connection to the Printed Circuit Board (PCB) ground that acts as a heat sink. Transferring heat from the MOSFET driver integrated circuit (IC) through the copper pad reduces thermal resistance by up to 50 percent and enables the MOSFET driver to operate cooler and more efficiently.

"The E-pad package is a significant milestone in Intersil’s Power Management roadmap," said George Lakkas, product marketing manager at Intersil. "It significantly improves the performance and reliability of non-isolated, step-down dc/dc converters, whether these are Voltage-Regulator-Module (VRM) style or embedded. E-Pad packaging was developed to address the market demand for increased power dissipation in limited motherboard area. Architects of next-generation communication and computer power systems will find these devices extremely beneficial for managing thermal dissipation in increasingly smaller power supply form factors as processor speeds and power consumption increase but dissipation area does not."

Implementing Intersil MOSFET drivers featuring the E-Pad package allows designers to reduce system costs. The E-Pad eliminates the need to add heat-sinks and to use more expensive MOSFETs featuring low on-resistance. Higher-power dc/dc converters can operate in smaller form factors, as less motherboard area is required to dissipate power. The package also allows the implementation of thinner copper PCB on the motherboard, reducing system cost even further. Because system reliability is improved through thermal resistance, less energy is used.

The HIP6601 and HIP6603 dual n-channel MOSFET driver ICs are Intersil’s first Power Management products offered in the E-pad package. The HIP6601MCP, along with Intersil’s HIP630X Multiphase Pulse-Width Modulator (PWM) IC family, has been designed into leading workstation motherboard platforms featuring AMD’s Athlon microprocessors.

Packaging, Pricing and Availability
The HIP6601 and HIP6603 are available in eight-lead SOIC and in an eight-lead SOIC E-Pad packaging. Pricing and part numbers are as follows:

For more information on the E-Pad HIP6601 and HIP6603 — including complete data sheets — visit Intersil’s homepage at www.intersil.com, or call 1-888-INTERSIL ext. 7991.

About Intersil Corporation
Intersil uses its semiconductor expertise to enable highly integrated voice, data and video communications. Intersil's integrated communications portfolio includes PRISM^® Wireless Local Area Network (WLAN) chip sets that enable mobile connectivity products for the home and office; analog, mixed-signal and digital integrated circuits for broadband access to wireless and wired Wide Area Networks (WANs); and power management products that enable 24x7 reliability in network servers, next generation PCs and information appliances. For more information about Intersil, visit the company's Internet homepage at at www.intersil.com.

PRISM is a registered trademark of Intersil Corporation.

The price information for the HIP6601 and HIP6603 in eight-lead SOIC and in an eight-lead SOIC E-Pad packaging contained herein, is subject to change without notice and it is not intended to, nor does it, create any contractual obligations or otherwise. The price information is for informational purposes only and does not reflect our current pricing. Current pricing can only be obtained through Intersil's authorized sales channels.

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