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Intersil's Endura ICs Power VIA's Leading New PC Platforms

-- Intersil powers VIA's P4PB-400 and EPIA Mini-ITX platforms~-- Endura solutions selected for quality, efficiency, reliability and overall value

IRVINE, CA, July 23, 2002 – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high performance analog and wireless networking solutions, today announced that VIA Technologies has chosen Intersil’s Endura solutions to power the Intel® Pentium® 4 processor on VIA’s new high performance range of mainboards. Endura solutions also power the embedded VIA C3™ E-series and VIA Eden™ ESP processors on the small form-factor VIA EPIA Mini-ITX mainboards.

“VIA is a leading innovator and developer of silicon chip technologies and PC platform solutions,” said Rick Furtney, vice president and general manager of Intersil’s High Performance Analog Product Group. “The new VIA P4PB 400 mainboard with its advanced feature set and the ultra compact VIA EPIA Mini-ITX platforms are clear examples of VIA’s innovation and leadership. Endura power management solutions offer the performance, efficiency and reliability these platforms require at a BOM cost lower than any other competitive offering.”

“VIA confidently selected Intersil’s Endura power solutions for our family of high performance Intel Pentium 4 processor mainboards and our highly integrated VIA EPIA Mini-ITX platforms based upon proven quality, reliability and cost-effective performance,” said Richard Brown, director of marketing, VIA Technologies, Inc. “Strongly influencing our decision was Intersil’s global market reach, rapid product development and excellent technical and customer support.”

VIA’s New P4PB 400 Mainboard with the VIA Apollo P4X400 Chipset
The VIA P4PB 400's performance features are exceptional and include support for AGP 8X, providing 2100 MB/sec of ultra-fast graphics bandwidth, double the speed of today's standard platforms. Support for DDR400/333 SDRAM and 533 MHz FSB allows the latest Intel Pentium 4 processors to perform to full capacity by supplying a massive 3200 MB/sec of fast double data rate (DDR) memory, eliminating all system data bottlenecks. Unsurpassed connectivity features also include integrated USB 2.0/1.1, IDE ATA/133, onboard IEEE 1394, 10/100 LAN, and a Smart Card connector.

Intersil’s Endura Core Power Solution on VIA’s P4PB 400 Mainboard
The Endura solution to power the Intel Pentium 4 processor on VIA’s new P4PB400 mainboard is the industry’s most advanced and efficient. Power for the Pentium 4 processor is precisely regulated using Intersil’s Endura HIP6301 four-phase PWM controller combined with the Endura HIP6601B synchronous rectified buck N-channel MOSFET drivers. The HIP6301 is the first and only 4-phase PWM buck controller IC designed to power Pentium 4 processors. The HIP6301’s scalable architecture of up to 4 phases enables the system designer to expand the output power of the dc/dc converter to be able to handle future higher-speed, more power-hungry processors with the same control IC. Endura multiphase chip sets enable the industry’s highest-performance and lowest-cost power management for Pentium 4 processors. This reference design enables the quick and easy transfer of the core regulator layout from one VIA Pentium 4 processor motherboard to another and greatly reduces the customer’s costs and time to market.

VIA’s Ultra Compact Mini-ITX and Embedded Applications Platforms
The new VIA EPIA Mini-ITX motherboard provides system integrators and OEMs with a standardized ultra compact yet highly integrated platform that can be utilized across multiple mini PC, Information Station, Information Server, and Broadband Gateway product lines. With a footprint that measures only 170 mm X 170 mm, the new VIA EPIA Mini-ITX motherboard is more than 33% smaller than any other motherboard form factor currently available on the market. It also comes with an incredibly rich feature set that includes a VIA C3™ E-series (EBGA package) or VIA Eden™ ESP embedded processor, integrated AGP graphics and audio, TV-Out connector, Ethernet networking, and integrated audio.

Market-leading thermal characteristics make the VIA Eden ESP processor based VIA EPIA Mini-ITX mainboard the ideal solution for ergonomic fanless system designs for a variety of innovative low profile, small form-factors, and translate into lower energy costs and longer battery life in mobile designs. Eden platforms are intended primarily for embedded-computer applications.

Intersil’s Endura Power Solutions for VIA’s C3 and Eden ESP Processor Platforms
VIA’s C3 E-series embedded processor platforms are powered by Intersil’s ISL6524CB quad power controller and the HIP6501A ACPI controller. The ISL6524CB includes one PWM controller for VRM 8.5 compatible processor core power and three linear regulators for the AGTL+, AGP and chip set core and/or cache memory circuits. The HIP6501A is a triple linear power controller that provides three ACPI-controlled voltages.

Platforms based on the VIA Eden ESP processor are powered by Intersil’s ISL6523 and HIP6012 controllers. The ISL6523 is a quad controller that includes one VRM 8.5-compatible PWM controller, a second PWM controller and two linear regulators for the AGTL+, AGP and chip set core and/or cache memory circuits. The HIP6012 is a synchronous-buck PWM controller that directly drives two N-channel MOSFETs. It provides complete control and protection. Intersil offers a wide range of Endura power solutions for existing and next-generation processor and system power control. Visit the Intersil Endura Web site to learn more at: http://www.intersil.com/endura

About VIA Technologies
VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia, communications, optical media and networking chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3™ processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2001. Additional information can be found at http://www.via.com.tw

Intersil + Elantec Means More for Our Customers
Intersil Corporation is a global semiconductor leader in the design and manufacture of high performance analog and wireless networking solutions. The acquisition of Elantec Semiconductor, Inc., expanded Intersil’s product portfolios to address four fast growing markets – flat panel displays, optical storage (CD and DVD recordable), power management and wireless networking. Intersil brings added customer value in providing complete silicon, software and reference design solutions to new products that enhance the computing experience for people wherever they live, work or travel. For more information about Intersil or to find out how to become a member of our winning team, visit the company's web site and career page at: www.intersil.com Endura is a trademark of Intersil Americas Inc.
Intel and Pentium are registered trademarks of Intel Corporation.
Rambus and RDRAM are registered trademarks of Rambus Inc.
C3 and Eden are trademarks of VIA Technologies, Inc.
All other trademarks mentioned are the property of their respective owners.