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Intersil Unveils the Industry’s Highest Performance Baseband Processor for Wireless Networking Systems

Intersil Unveils the Industry's Highest Performance Baseband Processor for Wireless Networking Systems

IRVINE, CA, June 7, 2000 – Intersil Corporation, the world’s leading developer of silicon technology for Wireless Local Area Networks (WLANs), today unveiled the world’s highest performance baseband processor chip for wireless networking systems.


IRVINE, CA, June 7, 2000 – Intersil Corporation, the world’s leading developer of silicon technology for Wireless Local Area Networks (WLANs), today unveiled the world’s highest performance baseband processor chip for wireless networking systems.

The HFA3863 Baseband Processor (BBP) is the latest and most advanced addition to Intersil’s extensive portfolio of PRISM® baseband chips for IEEE 802.11-based wireless networking systems. It is designed specifically for WLAN systems requiring robust operation in dense office environments and factory floors – areas where severe multipath interference is a significant threat to signal integrity.

The new device is one of four chips that comprise PRISM II.v, Intersil’s latest generation of the award-winning PRISM WLAN Chipset and the world’s only complete solution for next generation wireless networking products. PRISM chips are used in WLAN systems from industry-leading companies including Nokia, Siemens, Cisco, Compaq, 3Com, Dell, Nortel, Samsung, SpectraLink, Symbol, and Zoom.

"Our new baseband processor represents a highly cost-effective solution optimized for applications that require the utmost in reliability in severe multipath environments," said Larry Ciaccia, vice president and general manager of Intersil’s PRISM Wireless Products business. "By ensuring superior throughput even in the most challenging office environments, Intersil delivers the technology needed to provide workers with the freedom to roam about the workplace without wires – regardless of a location’s physical makeup."

Technical Features
The HFA3863 delivers superior multipath performance versus existing designs through the addition of an equalizer, which ensures radio signal integrity by substantially reducing intersymbol and interchip interference. The device’s on-board RAKE receiver further complements the equalizer, resulting in an industry-leading delay spread performance of 120 nanoseconds at 11 Megabits-per-second (Mbps). Collectively, these features help PRISM-enabled WLAN devices achieve robust throughput and extended operating range – important for severe multipath environments such as factory floors, department stores, dense offices and large auditoriums.

The HFA3863 BBP is a drop-in replacement – pending a firmware upgrade – to the HFA3861B, the existing baseband processor for Intersil’s PRISM® II.V Chip Set unveiled in February. The new chip delivers an 11Mbps data rate through use of Complementary Code Keying (CCK) technology, the modulation technique utilized in the approved IEEE 802.11b high rate standard for wireless LANs. With a variable data rate, Intersil’s new baseband processor can operate at 1, 2, 5.5 or 11Mbps. The variable rate allows 11Mbps systems to downshift when conditions deteriorate, ensuring link integrity; this also makes such systems backwards compatible with older WLAN equipment operating at the 1 and 2 Mbps data rate.

Built-in flexibility allows the HFA3863 to be configured through a general purpose control bus to fit a broad range of wireless applications. Automatic Gain Control (AGC) is provided for transmit and receive to obtain maximum performance in the analog portions of the transceiver. Along with the other three chips in PRISM II.V, the HFA3863 can serve as a full or half duplex packet baseband transceiver for other high-performance wireless applications, such as enterprise and IEEE802.11 WLANs, PCMCIA wireless transceivers, RF modems, TDMA packet protocol radios, wireless bridges and a variety of portable RF-based devices.

Packaging, Availability and Pricing
Housed in a plastic Thin Quad Flat Package (TQFP) suitable for PCMCIA board applications, the HFA3863 is now available for sampling for $16.20 in 10K quantities. Full production is slated for July. For quicker time-to-market, an evaluation board (HFA3863-EVAL1) and complete data sheet are also available. For more information, visit Intersil’s homepage at www.intersil.com/prism.

Adoption of PRISM WLAN Technology
Since introducing the PRISM WLAN chip set in 1996, over fifty companies have incorporated PRISM chips in more than 100 product designs. In a May 2000 report, Cahners In-Stat Group called Intersil "the dominant force in the WLAN chip set marketplace with their PRISM chipsets holding the majority of market share." PRISM technology is designed to comply with the IEEE’s 802.11 global standard, and Intersil is a founding sponsor of the Wireless Ethernet Compatibility Alliance (WECA), whose Wi-Fi™ brand is a mark of compatibility for 802.11-based systems. PRISM chips are used in WLAN systems from industry-leading companies including Nokia, Siemens, Cisco, Compaq, 3Com, Dell, Nortel, Samsung, SpectraLink, Symbol, and Zoom.

About Intersil
Intersil uses its semiconductor expertise to enable highly integrated voice, data and video communications. Intersil's integrated communications portfolio includes PRISM® Wireless Local Area Network (WLAN) chip sets that enable mobile connectivity products for the home and office; analog and mixed-signal integrated circuits for broadband access to wireless and wired Wide Area Networks (WANs); and power management products that enable 24x7 reliability in network servers, next generation PCs and information appliances. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.

This press release contains information relating to the growing demand for wireless products that are forward-looking statements as defined in the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based upon management’s current expectations, estimates, beliefs, assumptions, and projections about our business and our industry. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will" and variations of these words or similar expressions are intended to identify forward looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward looking statements. These forward-looking statements are subject to certain risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in the forward looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil in connection with the wireless market include, but are not limited to, the rate at which our present and future customers and end-users adopt Intersil’s wireless technologies and products; the timing, rescheduling or cancellation of significant customer orders; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability of foundry and assembly capacity and raw materials; intellectual property disputes; as well as other risk factors detailed from time to time in Intersil’s filings with the U.S. Securities & Exchange Commission. These forward-looking statements are made only as of the date of this press release and Intersil undertakes no obligation to update or revise these forward-looking statements.

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PRISM is a registered trademark of Intersil Corporation.

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