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Intersil to Showcase "Wireless at the Speed of Life" at Wireless Symposium

— Joins with leading partner companies to illustrate "Internet anywhere"

PALM BAY, FL, February 14, 2000 – Intersil Corporation, the world’s leading provider of silicon technology for Wireless Local Area Networks (WLANs), today announced it will participate as a Gold Sponsor at the upcoming Wireless Symposium/Portable by Design 2000 Conference in San Jose, Calif., on February 22-24, 2000.


PALM BAY, FL, February 14, 2000 – Intersil Corporation, the world’s leading provider of silicon technology for Wireless Local Area Networks (WLANs), today announced it will participate as a Gold Sponsor at the upcoming Wireless Symposium/Portable by Design 2000 Conference in San Jose, Calif., on February 22-24, 2000.

At its booth (#317), Intersil will join with leading WLAN vendors to demonstrate "Wireless at the Speed of Life" – a showcase illustrating the benefits of wireless everywhere we live and work. The centerpiece of the booth will consist of four large vignettes simulating wireless networks employed in the corporate office, the home, the small office and the airport. Leading sponsors include Compaq ("Wireless in the Corporate Office"); Nokia ("Wireless On The Move"); Siemens ("Wireless In the Small Office"); and Zoom ("Wireless In The Home").

In kiosks surrounding the center vignettes, Intersil will demonstrate customer products performing Voice-over-Internet Protocol (VoIP), wireless transmission of DVD movies, wireless Internet browsing and small wireless appliances, including wireless digital camcorders, palmtops and webpads. Throughout the booth, customer products from Compaq, Nokia, Siemens, Zoom, SpectraLink, Cisco/Aironet, Samsung, Sony, Casio, Hewlett-Packard, Hitachi, Mitsubishi, Fujitsu and others will be displayed. All products use wireless networking based on Intersil’s award-winning PRISM® direct sequence spread spectrum (DSSS) technology.

"The tremendous growth of the Wireless Symposium each year is a testament to the explosion in wireless applications and the opportunities they bring to life," said Larry Ciaccia, vice president and general manager of PRISM Wireless Products at Intersil. "We’re excited to join forces with some of the industry’s most innovative leaders to illustrate how wireless networking products can enhance our quality of life and help keep us connected to vital information wherever we may be."

Intersil also plans to announce additions to its PRISM WLAN product portfolio at the show and discuss further product roadmaps. Some of the new products include a new baseband processor and Medium Access Control (MAC) chip. Intersil focuses on advancing its portfolio with more highly integrated, lower power and smaller packaged ICs that are necessary for the future development of smaller, more portable wireless appliances. Part of this effort also involves the up-integration of functions previously performed by discrete active and passive components; by reducing the total parts count of board sub-systems, lower BOM cost can be achieved.

"Our customers must meet certain retail price points to stimulate wide acceptance of wireless LAN systems," Ciaccia said. "To help our customers, we focus development efforts on new ICs aimed at increasing performance and functionality while decreasing BOM cost and power consumption."

About the Wireless Symposium

Over 6,000 wireless designers and engineers are expected to attend the Eighth Annual Wireless Symposium/Portable by Design Conference. The conference will host more than 75 continuing-education workshops and technical sessions by leading design engineers, and features exhibitions by over 400 of the leading suppliers of hardware, software, services and test equipment for the wireless communications market.

Adoption of PRISM WLAN Technology

Since introducing the PRISM WLAN chip set in 1996, over fifty companies have incorporated PRISM chips in more than 100 product designs. PRISM technology is designed to comply with the IEEE’s 802.11 global standard and Intersil is a founding sponsor of the Wireless Ethernet Compatibility Alliance (WECA), whose "Wi-Fi" brand will ensure compatibility between various 802.11-based systems. Intersil has a continuing program to rapidly introduce better performing, more highly integrated generations of PRISM chip sets and supporting design tools. PRISM chips are used in WLAN systems from industry-leading companies including Nokia, Siemens, Compaq, 3Com, Nortel, Samsung, Dell, Zoom, Cisco/Aironet, and SpectraLink. Experience the latest PRISM technology at the upcoming Wireless Symposium & Exhibition in San Jose, Calif., February 22-24.

About Intersil
Intersil Corporation uses semiconductor expertise to enable highly integrated voice, data and video communications. Intersil's integrated communications portfolio includes PRISM® Wireless Local Area Network (WLAN) chip sets that enable mobile connectivity products for the home and office; analog, mixed-signal and digital integrated circuits for broadband access to wireless and wired Wide Area Networks (WANs); and power management products that enable 24x7 reliability in network servers, next generation PCs and information appliances. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.

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PRISM is a registered trademark of Intersil Corporation.

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