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Intersil Offers Space-Saving MOSFET Driver ICs in Micro Lead Frame Packages

-- New Endura™ ICs are small in size and big on performance~-- Small MOSFET driver ICs cover a wide range of applications from industrial to computer

IRVINE, CA, March 14, 2002 – Intersil Corporation (NASDAQ: ISIL), a leading provider of power management solutions for PCs, file servers and portable information appliances, today announced a new selection of high-performance MOSFET drivers offered in Micro Lead Frame Plastic (MLFP) packaging. These packages save significant board space and have a direct metal thermal path from driver die to the outside of the package. The new Endura HIP2100, HIP6602B and HIP6604B MLFP-packaged drivers are targeted for power designs where space is a significant constraint and power dissipation is a concern. Applications for the new Intersil drivers range from high-voltage telecom and avionics power supplies to low-voltage DC-to-DC converters for PC motherboards and peripherals.

“We are now offering many of our new and most popular products in the MLFP package because advances in technology and circuit density demand it,” said Rick Furtney, vice president and general manager of Intersil’s High-Performance Analog Business Unit. “The advantages offered by this space-saving package are significant and truly make a difference in achieving reliable high-density designs. Intersil offers customers products that provide advantages both in packaging and performance.”

New MLFP Packaged Drivers
HIP2100 Half-Bridge Driver, 100 V, MHz switching, 16-lead 5 X 5 mm MLFP package
HIP6602B Dual-Channel Driver, 12 V, MHz switching, 16-lead 5 X 5 mm MLFP package
HIP6604B Single-Channel Driver, 12 V, MHz switching, 16-lead 4 X 4 mm MLFP package

Advantages of MLFP Packaging

• Space Savings - MLFP packages are thinner in profile and are near-chip-scale package footprint, which reduces the amount of required board mounting area.
• Improved Thermal Characteristics - MLFP packages have a central grounded copper pad on the underside surface that is solder-bonded to the board during reflow. This provides excellent thermal transfer and adds mechanical stability for the contact pads along the IC's perimeter.
• Reduced Electrical Parasitics - MLFP packages use exposed pads on the undersurface perimeter of the package. This greatly reduces interconnect inductance and parasitic oscillation issues.
• Improved Reliability - Exposed pads eliminate solder irregularities and integrity issues caused by bent or misaligned leads in conventional packaging.
• Improved Solderability - During solder reflow, the MLFP package actually floats into proper orientation to the board lands. This provides automatic alignment and improves solder connection integrity.
• Compliant To JEDEC PUB95 MO-220 QFN - Quad Flatpack No Leads - Product Outlines

Intersil Endura HIP2100 100-V High-Frequency Half Bridge MOSFET Driver
The HIP2100 drives two N-channel MOSFETs in an up-to 100-V half-bridge configuration. It is offered in both 16-lead 5 X 5 mm MLFP and 8-lead SOIC packages. The MLFP package reduces required mounting area by 15%, reduces thermal resistance by a significant 63% and is 42% thinner compared to the 8-lead SOIC package. This high-frequency driver has very short propagation times enabling MHz switching frequencies. It is capable of driving a 1000-pF load at 1 MHz with a rise and fall time of typically 10 ns. An on-chip diode used for high-side bootstrap reduces additional parts count and further conserves board space. Independent high- and low-side inputs allow the driver to be used in non-half-bridge topologies. Both high- and low-side drivers are under-voltage protected.

Intersil Endura HIP6602B Dual-Channel Synchronous Buck MOSFET Driver
The HIP6602B is a high-frequency two-channel MOSFET driver specifically designed to drive four N-channel MOSFETs in a dual synchronous-buck converter topology. This dual driver is now offered in both 16-lead 5 X 5 mm MLFP and 14-lead SOIC packages. The MLFP package reduces required mounting area by 52%, reduces thermal resistance by 50% and is 42% thinner compared to the 14-lead SOIC package. Each channel of the IC drives both upper and lower MOSFET gates over a range of 5 V to 12 V. This drive voltage flexibility provides design optimization in favor of either switching loss or conduction loss reduction. Switching frequency ranges up to 2 MHz. Each channel output is capable of driving a 3000-pF load with a 30 ns propagation delay and 50 ns transition time. Two on-chip bootstrap diodes reduce parts count and save board space. The HIP6602B also includes adaptive shoot-through and under-voltage protection along with tri-state inputs for bridge shutdown.

Intersil Endura HIP6604 Synchronous Buck MOSFET Driver
The HIP6604B is a synchronous buck MOSFET driver IC available in both the 16-lead 4 X 4 mm MLFP and the 8-lead SOIC packages. The MLFP package reduces required mounting area by 46%, reduces thermal resistance by 56% and is 42% thinner compared to the 8-lead SOIC package. This IC is a single channel device that has the same operating characteristics as the HIP6602B. In addition, the HIP6604B can be configured with both the upper and lower gate drives in the range of 5 V to 12 V, or the upper drive in the range of 5 V to 12 V while the lower drive is fixed at 12 V. This choice of configuration offers designers the ability to optimize the power design as desired.

MLFP Packaged Driver Availability and Pricing

HIP2100IRT	6 wks ARO	Tape & Reel	6000 MLQ	$2.00 each
HIP6602ACR-T	Now Sampling	Tape & Reel	6000 MLQ	$2.20 each
HIP6604CR-T	Now Sampling	Tape & Reel	6000 MLQ	$1.33 each

Evaluation platforms and application notes are available for all drivers. ICs are also in SOIC packages.

Intersil Power Management Technology
The Intersil Endura product family consists of leading power management solutions for desktop and mobile PCs, workstations, Internet appliances, I/O cards, RAID systems and high-availability servers. The Endura family includes high-efficiency solutions that are used in portable PCs and mobile information appliances as well as residential gateway products. Intersil’s leadership position has grown, capturing over 50 percent of the AMD Athlon™ and Intel® Pentium® 4 processors and providing power management solutions for next generation desktop, portable and wireless communications devices. The company is the first to introduce a complete cost effective power solution for new and next generation PCs that uses a multiphase power configuration to achieve unparalleled precision and efficiency. Learn more about Intersil’s Endura products at: http://www.intersil.com/endura About Intersil
Intersil is a global leader in designing innovative wireless networking and high performance analog solutions that enable wireless access to video, data and voice in homes, offices and public places. Creating advanced power management products, Intersil provides reliable solutions for file servers, portable information appliances and over half of all computer microprocessors manufactured today. With a rich high performance analog and mixed signal portfolio, Intersil brings added value in providing complete silicon, software and reference design solutions to new products that bring portable connectivity to people wherever they live, work or travel. Headquartered in Irvine, California, Intersil has offices in cities throughout the US, Europe and Asia. For more information about Intersil or to find out how to become a member of our winning team, visit the company's Web site and career page at: www.intersil.com

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