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May 29 2002
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News & Events
Intersil Names Alden Chauvin as Vice President of Worldwide Sales


IRVINE, CA, May 29, 2002 – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high performance analog and wireless networking solutions, announced today that Alden Chauvin is Intersil’s new Vice President of Worldwide Sales. In his new position, Alden will lead Intersil’s worldwide original equipment manufacturer (OEM) and distributor sales as the company expands its leading positions in the flat panel display, optical storage (CD and DVD recordable), power management and wireless networking markets. Mr. Chauvin will also serve as an executive officer of Intersil.

Alden Chauvin joins Intersil following the company’s acquisition of Elantec Semiconductor, Inc., on May 14, 2002. Mr. Chauvin served as Elantec’s Vice President of Worldwide Sales since joining the company in April 1999.

“Alden’s leadership experience will allow us to build even stronger customer relationships in the high performance analog and wireless networking markets and continue to expand Intersil’s global presence,” said Rich Beyer, president and CEO of Intersil. “He helped Elantec to establish leading positions in optical storage, video and communications markets, enabling Elantec to outgrow the overall semiconductor industry for the past two years. The combination of the Intersil and Elantec portfolios enhances our value as a strategic high performance analog supplier, and with Alden’s leadership and Intersil’s creative channel strategies the company is in a great position to capitalize on growth opportunities.”

Prior to joining Elantec, Mr. Chauvin served as Vice President of Worldwide Sales of Singapore-based Tritech Microelectronics from August 1997 through July 1998. Mr. Chauvin was previously Vice President of Worldwide Sales for Sierra Semiconductor (now PMC-Sierra) from April 1995 through June 1997, where he had served as Vice President of North America Sales from June 1986 through March 1995. Prior to Sierra Semiconductor, he held various sales and marketing management positions over a 17-year period at Texas Instruments, Inc. Mr. Chauvin holds a B.S. degree in industrial technology from Louisiana State University. About Intersil
Intersil Corporation manufactures and markets high performance analog and wireless networking solutions. As a global semiconductor leader, Intersil focuses on four of the industry's fastest growing markets – flat panel displays, optical storage (CD and DVD recordable), power management and wireless networking. Intersil brings added customer value in providing complete silicon, software and reference design solutions to new products that enhance the computing experience for people wherever they live, work or travel. For more information about Intersil or to find out how to become a member of our winning team, visit the company's web site and career page at www.intersil.com.

This press release contains forward-looking statements as defined in Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements are based upon Intersil Corporation’s (“Intersil”) management’s current expectations, estimates, beliefs, assumptions, and projections about Intersil’s, and its Elantec Product Group’s (“Elantec”), business and industry. Words such as "anticipates," "expects," "intends," "plans," “predicts,” "believes," "seeks," "estimates," "may," "will," “should,” “would,” “potential,” “continue,” and variations of these words (or negatives of these words) or similar expressions, are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections, or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to certain risks, uncertainties, and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil, some of which may apply to Elantec, include, but are not limited to: the slowdown in the technology sector; the rate at which consumers adopt small handheld Internet appliances and portable computing devices in enterprises and in homes; the rate at which consumers purchase notebook computers; the rate at which our present and future customers and end-users adopt Intersil’s wireless access, communications analog, and other analog technologies and products; the rate at which consumers adopt Elantec’s optical storage (CD and DVD recordable), video and communications technologies and products; the timing, rescheduling or cancellation of significant customer orders; the ability of our customers to manage inventory; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability and quality of our foundry capacity and raw materials; availability, pricing, and quality of third party foundry and assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party foundries and assembly and test facilities, and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly and test facilities; problems or delays that we may face in shifting our products to smaller geometry process technologies; the effectiveness of Intersil’s expense and product cost control and reduction efforts; the risks inherent in acquisitions, including the acquisition of Elantec (including integration issues; costs and unanticipated expenditures; changing relationships with customers, suppliers, and strategic partners; potential contractual, employment, and intellectual property issues; risks of not securing regulatory approvals; accounting treatment and charges; and the risks that the acquisition cannot be completed successfully, or that the anticipated benefits of the acquisition are not realized); intellectual property disputes, customer indemnification claims, and other litigation risks; Intersil’s ability to develop, market, and transition to volume production new products and technologies in a timely manner, as well as other risk factors. Intersil’s recently filed joint proxy statement/prospectus related to the merger with Elantec, Annual Report on Form 10-K and other Intersil filings with the U.S. Securities and Exchange Commission (“SEC”) (which you may obtain for free at the SEC’s web site at www.sec.gov) discuss some of the important risk factors that may affect our business, results of operations, and financial condition. These forward-looking statements are made only as of the date of this communication and Intersil undertakes no obligation to update or revise these forward-looking statements.

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Kelly Maxwell
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Phone: 1-408-546-3582
Email: kmaxwell@intersil.com

Intersil Corporation
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Milpitas, CA 95035

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Kelly Ang

Phone: +86-21-6335-1198 x115
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Intersil Corporation
Unit 1507-11, One ICC, Shanghai ICC, 999 Middle Huaihai Road, Xuhui District, Shanghai, 200031 P.R. China

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Rie Ito

Phone: +81-354392316
Email: rito@intersil.com

Intersil Corporation
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Tokyo 1080073
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Oliver Davies

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Publitek Limited
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Ulrich Mengele

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Email: ulrich.mengele@mengele-pmc.de

Mengele PMC GmbH
Gesslerstr. 15, 80689 München
www.mengele-pmc.de

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