Press Releases
Intersil Joins Corporate Affiliates Program at University of California, San Diego

— Intersil to collaborate on R&D through UCSD Jacobs School of Engineering’s Center for Wireless Communications

IRVINE, CA. — May 26, 2000 — Intersil (NASDAQ: ISIL), the world’s leading developer of silicon technology for Wireless Local Area Networks (WLANs), today announced that it has joined the Corporate Affiliates Program at the University of California, San Diego (UCSD) Jacobs School of Engineering. Intersil also plans to collaborate on wireless research and development as a member of the school’s Center for Wireless Communications.

"We look forward to developing a long-term relationship with UCSD and the Jacobs School’s Center for Wireless Communications," said Greg Williams, president and CEO of Intersil Corporation. "Our joint efforts will not only provide potential benefits to Intersil and the Los Angeles/San Diego corridor, but to a global market fueled by growing demand for wireless access to broadband communications content."

"We are always pleased when a leading wireless company such as Intersil partners with us at UCSD," said Robert W. Conn, Dean of the Jacobs School of Engineering. "Intersil brings a complementary set of talents and capabilities to the corporate roster of our Wireless Center. We expect Intersil to add great value and to provide an added perspective on major issues of critical importance to the development of circuits and systems on chips for wireless communications and mobility."

The Center for Wireless Communications of the University of California, San Diego offers a cross-disciplinary program of research and education targeted at the emerging needs of the cellular and wireless communications industry. Founded in February 1995, the Center is committed to developing a strong university-industry partnership needed for producing a relevant program of systems and technology-oriented research. The Center places high priority on strategic planning, collaboration, technology transfer, and the generation of highly trained graduates at all degree levels to meet industrial human resources needs.

Intersil — which recently announced plans to establish a West Coast corporate office and design center in Irvine — is a recognized leader in the development of WLAN chips and chip sets. Since introducing the PRISM^® WLAN chip set in 1996, over fifty companies have incorporated PRISM chips in more than 100 product designs. Intersil has a continuing program to rapidly introduce better performing, more highly integrated generations of PRISM chip sets and supporting design tools. PRISM chips are used in WLAN systems from industry-leading companies including Nokia, Siemens, Compaq, 3Com, Nortel, Samsung, Dell, Zoom, Cisco/Aironet, and SpectraLink.

About Intersil
Intersil uses its semiconductor expertise to enable highly integrated voice, data and video communications. Intersil's integrated communications portfolio includes PRISM^® Wireless Local Area Network (WLAN) chip sets that enable mobile connectivity products for the home and office; analog and mixed-signal integrated circuits for broadband access to wireless and wired Wide Area Networks (WANs); and power management products that enable 24x7 reliability in network servers, next generation PCs and information appliances. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.

This press release contains information relating to the growing demand for wireless products that are forward looking statements as defined in the Private Securities Litigation Reform Act of 1995. Such forward looking statements are based upon management’s current expectations, estimates, beliefs, assumptions, and projections about our business and our industry. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will" and variations of these words or similar expressions are intended to identify forward looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward looking statements. These forward looking statements are subject to certain risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in the forward looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil in connection with Wireless market include, but are not limited to, the rate at which our present and future customers and end-users adopt Intersil’s wireless technologies and products; the timing, rescheduling or cancellation of significant customer orders; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability of foundry and assembly capacity and raw materials; intellectual property disputes; as well as other risk factors detailed from time to time in Intersil’s filings with the U.S. Securities & Exchange Commission. These forward looking statements are made only as of the date of this press release and Intersil undertakes no obligation to update or revise these forward looking statements.

PRISM is a registered trademark of Intersil Corporation.

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