News & Events
Intersil Introduces Product Family that Extends Battery Life<br> in Portable Information Appliances

— First in a series of power management devices
that significantly improves power efficiency

IRVINE, CA., October 11, 2000 — Intersil (NASDAQ: ISIL), a leader in power management solutions for desktop PCs and portable information appliances, today announced the initial product offering of power management devices specifically designed to increase battery life in notebook PCs and other portable information appliances and to increase power efficiency in desktop computers. The UltraFET^® Trench family of discrete power products utilizes Intersil’s DenseTrench™ technology in high efficiency, low voltage applications.

"Anyone who regularly operates a laptop computer recognizes the need for increased battery life, and Intersil is pleased to introduce devices that will significantly help to meet this need, " says Krishna Kuchimanchi, product marketing manager at Intersil. "Intersil’s UltraFET Trench, low voltage, discrete power products improve the efficiency of the devices controlling power switching in battery powered and desktop products. The result is longer battery life in portable devices and increased power efficiency in desktop deployments. This initial offering is the latest example of Intersil innovation contributing to next generation communications networks."

Intersil has engineered the devices to increase battery life and to more efficiently use power by reducing the amount of power lost during switching. Efficient use of power is vital to the operation of new, high-current microprocessors in desktop and portable applications.

Intersil’s initial UltraFET Trench product offering consists of 30-volt metal oxide semiconductor field effect transistors (MOSFETs), which are tiny electrical switches used in information appliances for power management. Intersil optimizes these MOSFETs to increase switching speed and to lower gate charge and input capacitance, characteristics critical to efficient power usage. The UltraFET Trench devices utilize Intersil’s DenseTrench technology, so that only a minimal amount of the surface area of the printed circuit board is used.

About DenseTrench Technology
UltraFET Trench devices utilize trench technology that differs from the planar technology traditionally used in Intersil’s standard UltraFET products. Intersil’s patented DenseTrench technology increases channel density within each MOSFET, resulting in increased efficiency. Simply put, the more channels present in a unit silicon area of a MOSFET, the lower the resistance of the device. Lower resistance equates to better system and device efficiency. Channel density of Intersil’s new UltraFET Trench MOSFET devices has been dramatically increased and is more than twice that of competitive trench designs. In portable applications, this manifests itself in longer battery life. In desktop PCs and network servers, power efficiency is increased.

Technical Information
Intersil’s fast-switching 30V UltraFET Trench MOSFETs, part number ISL9N310A, is offered in Dpak, D2Pak and TO220 packages. The devices reduce the gate charge and capacitance by 50 percent while reducing Rds(on), resulting in increased efficiency and longer battery life.

Intersil designs and produces semiconductors tailored for high efficiency, high reliability integrated communications applications. When combined with the company’s power integrated circuits, Intersil’s power product portfolio provides unique power management solutions for next generation portable and desktop PCs, network servers supporting the Internet and information appliances.

Pricing, Packaging and Availability
Intersil’s 30V UltraFET Trench offerings, the ISL9N310AD3ST, ISL9N310AS3ST and ISL9N310AP3, are currently available in Dpak, D2pak and TO220 packages respectively. The devices are priced at $0.80 in 1000 piece quantities. For more information about Intersil’s UltraFET Trench, visit the Web site at www.intersil.com or call 1-888-INTERSIL ext. 8001.

About Intersil Corporation
Intersil Corporation uses semiconductor expertise to enable highly integrated voice, data and video communications. Intersil's integrated communications portfolio includes PRISM^® Wireless Local Area Network (WLAN) chip sets that enable mobile connectivity products for the home and office; analog, mixed-signal and digital integrated circuits for broadband access to wireless and wired Wide Area Networks (WANs); and power management products that enable 24x7 reliability in network servers, next generation PCs and information appliances. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.

This press release contains information relating to the power management market that includes forward-looking statements as defined in the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based upon management’s current expectations, estimates, beliefs, assumptions, and projections about our business and our industry. Words such as "anticipates, " "expects, " "intends, " "plans, " "believes, " "seeks, " "estimates, " "may, " "will" and variations of these words or similar expressions are intended to identify forward looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward looking statements. These forward-looking statements are subject to certain risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in the forward looking statements as a result of various risk factors. Important risk factors that may cause such a difference for Intersil Holding Corporation ("Intersil") in connection with the power management market include, but are not limited to, the rate at which our present and future customers and end-users adopt Intersil’s power management technologies and products; the timing, rescheduling or cancellation of significant customer orders; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability of foundry and assembly capacity and raw materials; intellectual property disputes; as well as other risk factors detailed from time to time in Intersil’s filings with the U.S. Securities & Exchange Commission ("SEC"). These forward-looking statements are made only as of the date of this press release and Intersil undertakes no obligation to update or revise these forward-looking statements.

For a detailed discussion of these and other cautionary statements, please refer to Intersil's filings with the SEC including its most recent Annual Report on Form 10-K and Quarterly Report on Form 10-Q, its Registration Statement on Form S-1, as amended, and the amendment to Registration Statement on Form S-4 recently filed by Intersil.

DenseTrench is a trademark of Intersil Corporation.
UltraFET is a registered trademark of Intersil Corporation.

PRISM is a registered trademark of Intersil Corporation.

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