News & Events
Intersil Appoints Rajeeva Lahri and Steve Titus to Lead Company’s Technology and Worldwide Operations

-- Rajeeva Lahri to spearhead Intersil’s Technology Operations~-- Steve Titus to lead the company’s Worldwide Operations

IRVINE, CA, August 5, 2002 – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high performance analog and wireless networking solutions, announced today that Rajeeva Lahri was named the new Chief Technology Officer (CTO) and Steve Titus was selected as Vice President of Worldwide Operations. Dr. Lahri is responsible for Intersil’s Technology Operations and will oversee the company’s process technology, packaging and reliability engineering and design systems. Mr. Titus will lead Intersil’s worldwide manufacturing and planning efforts.

“Rajeeva and Steve bring more than 40 years of combined semiconductor manufacturing and technology experience to their roles and their strong leadership will help contribute to our success as a high performance analog and wireless networking solutions provider,” said Intersil president and CEO Rich Beyer. “Their experience and the combined contributions of their teams will allow Intersil to maximize operational efficiencies and expand our innovative technology leadership in our target markets.”

Dr. Lahri brings over 20 years of semiconductor technology leadership to his role, including technology management at Elantec, Philips, VLSI Technology, National Semiconductor and Hewlett Packard. He will lead his global teams in the management of resources necessary to leverage Intersil's process and design leadership. Dr. Lahri holds a Master of Science degree in physics and a Master of Technology degree in solid-state electronics, both from the Indian Institute of Technology in Kanpur, India. In addition, he holds a Ph.D. in electrical engineering from State University of New York in Buffalo, New York.

Steve Titus will lead Intersil’s Worldwide Operations, providing oversight of the company’s quality, environmental health & safety, plant services, purchasing, operations planning, internal manufacturing and foundry management functions. Mr. Titus has 23 years of manufacturing management experience, including 19 years at Intersil. He was most recently Intersil’s Vice President of Plant Operations. He and his teams will help plan, implement and track Intersil's internal and external manufacturing resources worldwide. Mr. Titus earned a Bachelor of Science degree in chemistry and a Bachelor of Science degree in mathematics from Wisconsin State University-Superior.

Intersil + Elantec Means More for Our Customers
Intersil Corporation is a global semiconductor leader in the design and manufacture of high performance analog and wireless networking solutions. The acquisition of Elantec Semiconductor, Inc., expanded Intersil’s product portfolios to address four fast growing markets – flat panel displays, optical storage (CD and DVD recordable), power management, and wireless networking. Intersil brings added customer value in providing complete silicon, software and reference design solutions to new products that enhance the computing experience for people wherever they live, work or travel. For more information about Intersil or to find out how to become a member of our winning team, visit the company's web site and career page at www.intersil.com

This press release contains forward-looking statements as defined in Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements are based upon Intersil Corporation’s (“Intersil”) management’s current expectations, estimates, beliefs, assumptions, and projections about Intersil’s business and industry. Words such as “anticipates,” “expects,” “intends,” “plans,” “predicts,” “believes,” “seeks,” “estimates,” “may,” “will,” “should,” “would,” “potential,” “continue,” and variations of these words (or negatives of these words) or similar expressions, are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections, or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to certain risks, uncertainties, and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil include, but are not limited to: the slowdown in the technology sector generally and the semiconductor industry specifically; the rate at which our present and future customers and end-users adopt Intersil’s high performance analog, wireless access, optical storage, and flat panel display technologies and products; the rate at which consumers; the rate at which consumers purchase small handheld Internet appliances, portable computing devices, notebook computers, optical storage (CD and DVD recordable), video and communications technologies and products; the timing, rescheduling or cancellation of significant customer orders; the ability of our customers to manage inventory; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability and quality of our foundry capacity and raw materials; availability, pricing, and quality of third party foundry and assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party foundries and assembly and test facilities, and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly and test facilities; problems or delays that we may face in shifting our products to smaller geometry process technologies; the effectiveness of Intersil’s expense and product cost control and reduction efforts; the risks inherent in acquisitions, including the acquisition of Elantec Semiconductor, Inc. (including integration issues; costs and unanticipated expenditures; changing relationships with customers, suppliers, and strategic partners; potential contractual, employment, and intellectual property issues; risks of not securing regulatory approvals; accounting treatment and charges; and the risks that the acquisition cannot be completed successfully, or that the anticipated benefits of the acquisition are not realized); intellectual property disputes, customer indemnification claims, and other litigation risks; Intersil’s ability to develop, market, and transition to volume production new products and technologies in a timely manner; the quality of Intersil’s products and any repair or replacement costs; the risks and uncertainties associated with Intersil’s global operations, particularly in light of the war on terrorism; the effects of natural disasters, international conflicts and other events beyond our control; the level of orders received and the ability to fill those orders in a given fiscal quarter; and other factors. Intersil’s Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Intersil filings with the U.S. Securities and Exchange Commission (“SEC”) (which you may obtain for free at the SEC’s web site at www.sec.gov) discuss some of the important risk factors that may affect our business, results of operations, and financial condition. These forward-looking statements are made only as of the date of this communication and Intersil undertakes no obligation to update or revise these forward-looking statements.