News & Events
Intersil Announces World’s Smallest Ringing SLIC for VoIP Applications

— New VoIP gateway product triples line-circuit packing density in home gateway and router products

IRVINE, CA., January 9, 2001 — Intersil Corporation (NASDAQ: ISIL), a leading developer of silicon technology for wireless access and communications markets, today unveiled a Voice over Internet Protocol (VoIP) ringing subscriber line interface circuit (SLIC) featuring a leadless, ultra-thin, small footprint package. The new package results in the smallest VoIP ringing SLIC in the industry and directly addresses the need for increased space efficiency in today’s home gateway and router products.

Intersil’s HC55185 VoIP ringing SLIC triples line-circuit packing density, enabling designers to deploy three devices in the space that was previously occupied by a single, legacy ringing SLIC. Performance and reliability baselines are maintained while thermal characteristics are significantly improved by providing more direct conduction paths between the integrated circuit and the printed circuit board.

"Combining new packaging capability with Intersil’s SLIC technology greatly enhances our ability to deliver performance in smaller form factors," said Michael Althar, vice president of Intersil’s VoIP gateway products. "Intersil is driven by the market’s demand for increased density and the ability to manage the thermal challenges of today’s converging telecommunications applications. Advances in our SLIC technology and advanced industry packaging solutions are key contributors to Intersil’s successful VoIP gateway product portfolio and are the foundation for our future product roadmap."

Intersil’s new VoIP ringing SLIC product features exposed die mount pads that make direct contact with the PC board, serving as a direct heat-sinking path and aiding in the reduction of heat. Lead coplanarity is not an issue because the external leads, or interconnect pads, of the package are integrated into the plastic body. The HC55185 ringing SLIC can be mounted with standard production equipment and without special soldering processes.

The seven millimeter by seven millimeter, 32-lead package uses less than one-third of the board surface area occupied by the industry standard 12.5mm by 12.5mm, 28-lead plastic leaded chip carrier package. The package is also less than one-fourth the height of similar, standard devices. The HC55185 ringing SLIC will be available by the end of March 2001.

About Intersil VoIP Ics
Intersil’s HC55185 VoIP gateway product and the recently announced ISL5586 add to the versatility of the company’s RSLIC18™ Ringing SLIC family by adding devices that can be used in Data Over Cable System Interface Specification 1.1 compliant equipment. Products based on this standard will support the connection of traditional primary line telephone handsets to cable modems. Intersil’s VoIP gateway products are also used in DSL modems and Integrated Access Devices, as well as voice and data routers. For further information about the Intersil HC55185, visit Intersil’s Web site at www.intersil.com, or call 1-888-INTERSIL, ext. 8006.

About Intersil
Intersil is a leading supplier of semiconductors, reference designs and software for wireless access and communications markets. Intersil applies analog, mixed-signal and radio frequency (RF) expertise to products that enable wireless access to broadband media; provide reliable power management for PCs, file servers and portable information appliances; and convert analog and digital signals in cellular and Internet infrastructure. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.

This press release contains statements relating to certain projections and business trends concerning the VoIP ringing SLIC market that are forward-looking statements as defined in the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based upon management’s current expectations, estimates, beliefs, assumptions, and projections about our business and industry. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will" and variations of these words or similar expressions are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to certain risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various risk factors. Important risk factors that may cause such material differences for Intersil Holding Corporation ("Intersil") in connection with the VoIP ringing SLIC market include, but are not limited to, the rate at which our present and future customers and end-users adopt Intersil’s VoIP ringing SLIC technologies and products; the timing, rescheduling or cancellation of significant customer orders; the loss of a key customer; the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; silicon wafer pricing and the availability of foundry and assembly capacity and raw materials; intellectual property disputes; as well as other risk factors detailed from time to time in Intersil’s filings with the U.S. Securities & Exchange Commission ("SEC") which you may obtain for free at the SEC’s website www.sec.gov. These forward-looking statements are made only as of the date of this press release and Intersil undertakes no obligation to update or revise these forward-looking statements.

RSLIC18 is a trademark of Intersil Corporation.

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