News & Events
Intersil Announces World's Smallest 100-V Half-Bridge Driver ICs

-- Popular HIP2100 and HIP2101 MOSFET driver ICs now in E-pad SOIC and 4 X 4 DFN packages

MILPITAS, CA, January 21, 2004 – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high performance analog solutions, today announced that the very popular HIP2100 and HIP2101 high-voltage half-bridge MOSFET driver ICs are now available in new space-saving and thermally efficient packages. The new 8-lead exposed-pad (EP or E-pad) SOIC package offers enhanced thermal efficiency and the 4 X 4 mm dual flat no-lead (DFN) package yields the world’s smallest 100-V half-bridge MOSFET driver. Applications for these thermally enhanced drivers include, but are not limited to, telecom and datacom power supplies, avionics DC/DC converters, two-switch forward converters and active-clamp forward converters.

"Our very successful HIP2100 and HIP2101 high-voltage half-bridge MOSFET driver ICs are now being offered in the space-saving and thermally efficient EPSOIC and DFN packages to address the market demand for increased power dissipation in limited board area,” said Randy Roberts, Director of Intersil’s Broadband Power Products. “These drivers, in the very small DFN package, offer designers the highest possible thermal efficiency in the world’s smallest package, saving not only space but costs associated with avoiding heroic heat sinking and/or more costly MOSFETs.”

Intersil’s exposed-pad device package is a thermally enhanced eight-lead small-outline integrated circuit (EPSOIC) that enables power supplies to run cooler and more efficiently. This enhanced package features a copper pad connection to the printed circuit board ground, which serves as a heat sink. Transferring heat from the MOSFET driver integrated circuit (IC) through the copper pad reduces thermal resistance by up to 50 percent and enables the MOSFET driver to operate cooler and more efficiently.

The 4 X 4 mm DFN version is sampling to customers now and will be released to full production in about sixteen weeks. It is the smallest 100-V half-bridge MOSFET driver available that allows engineers to adhere to IPC-2221 design standards for printed circuit board layout. The guidelines call for 0.6 mm of spacing between high voltage nodes in order to assure long-term system reliability.

HIP2100 & HIP2101 Technical Summary

• World’s smallest 100-V half-bridge MOSFET drivers in the 4 X 4 mm DFN package
• Small space and enhanced thermal efficiency in the EPSOIC and DFN packages
• SOIC, EPSOIC and DFN package options
• Lead-free available in SOIC package
• Bootstrap supply max voltage to 114 VDC
• On-chip 1-Ohm bootstrap diode
• Fast propagation times needed for multi-MHz circuits
• 2-A gate drive current
• Drives 1000-pF load with rise and fall times typically of 10 ns
• HIP2101 – TTL/CMOS input thresholds
• HIP2100 – CMOS input thresholds
• Independent inputs for non-half-bridge topologies
• Outputs unaffected by supply glitches, HS ringing below ground, or HS slewing at high dv/dt
• Low power consumption
• Wide supply range, 9 to 14-V chip bias
• Supply under-voltage protection
• 3-Ohm output resistance
• Industrial temperature range for all ICs

HIP2100 & HIP2101 Pricing and Availability
The HIP2100 and HIP2101 are available now. The suggested resale price in 1000-unit quantities is $1.88 each for the HIP2100IR4 and HIP2101IR4 (DFN package) and $1.70 for the HIP2100EIB and HIP2101EIB (EPSOIC package). About Intersil
Intersil Corporation is a leader in the design and manufacture of high performance analog semiconductors. The company’s products address three of the industry’s fastest growing markets - flat panel displays, optical storage (CD and DVD recordable) and power management. Intersil products include power management devices for battery management, hot-swap and hot-plug controllers, linear regulators, supervisory ICs, switching DC-DC regulators and power MOSFET drivers; optical storage laser diode drivers; DSL line drivers; video and high performance operational amplifiers; data converters; interface ICs; analog switches and multiplexers; crosspoint switches; voice-over-IP devices; and ICs for military, space and rad-hard applications. For more information about Intersil or to find out how to become a member of our winning team, visit the company’s web site and career page at: www.intersil.com.

This release may include "forward looking statements" that are subject to risks and uncertainties. For information identifying economic, political, climatic, currency, regulatory, technological, competitive and some other important factors that could cause actual results to differ materially from those anticipated in the forward looking statements, see Intersil’s Safe Harbor Forward Looking Statement disclaimer found at http://www.intersil.com/legal.asp, as well as Intersil’s SEC filings as updated from time to time, found at http://www.sec.gov.