News & Events
Intersil Announces Evaluation Kit For Sampling OC3 Broadband Wireless Modem Chip Set
To be demonstrated this week at Intersil’s booth (#815) at the Broadband Wireless World Forum
IRVINE, CA., February 26, 2001 — Intersil Corporation (NASDAQ: ISIL), a leading provider of silicon technology for wireless access and communications analog markets, announced today the availability of an evaluation platform to help OEM customers easily evaluate its new 155 megabit-per-second (OC3) modem chipset and reference design. Intersil’s ISL83700 modem evaluation kit provides a means to configure, monitor and test the performance of Intersil’s ISL8760 modem chipset in a lab environment.
IRVINE, CA., February 26, 2001 Intersil Corporation (NASDAQ: ISIL), a leading provider of silicon technology for wireless access and communications analog markets, announced today the availability of an evaluation platform to help OEM customers easily evaluate its new 155 megabit-per-second (OC3) modem chipset and reference design. Intersils ISL83700 modem evaluation kit provides a means to configure, monitor and test the performance of Intersils ISL8760 modem chipset in a lab environment.
Intersils new chip set developed by recently-acquired SiCOM, Inc. and to be released into production early next month will enable rapid, low-cost deployment of Point-to-Point (PTP) microwave radios that support next generation base station interconnection and fixed wireless access at flexible data rates of up to 155 megabit-per-second (Mbps). The new ISL83700 modem evaluation kit incorporates the new chipset in a complete, self-contained test platform enabling customers to sample the modem chip set and immediately support demo requirements, performance evaluation and lab testing.
A sophisticated graphical user interface (GUI) allows users to easily test a wide variety of modem configurations to optimize wireless link capacity and bit error rate (BER) performance. Programmable features include: modulation code rates, data rates, baud rates, selectable IF (VHF and L-Band), Reed-Solomon encoding/decoding, PTCM inner code, equalization, and linearization. This powerful software also includes built-in BER performance testing and constellation mapping. Test ports allow direct interface to common test equipment PCs.
Intersils new OC-3 modem evaluation system will be demonstrated at its booth (#815) at the Broadband Wireless World Forum, February 19th & 20th at the Moscone Center in San Francisco.
Price and Availability
Intersils ISL83700 Modem Evaluation Kit is now available for $3,500. The ISL87060MIK modulator chip and the ISL87060DIK demodulator chip will be available in April for $95 each in minimum 2K quantities. To implement the chipset, customers are required to execute a license agreement and purchase the ISL837030 reference design, which is available for $20,000.
About Intersil BWA Products
Intersil acquired Scottsdale, Arizona-based SiCOM in October 2000, and today offers broadband modem silicon solutions, reference designs and software to equipment manufacturers serving fixed wireless infrastructure and access markets. Intersils BWA portfolio also includes the companys popular CommLink family of software-programmable digital radio chips and CMOS data converters designed specifically for current and next generation cellular base stations. For more about Intersils BWA products, visit its Web site at www.intersil.com/design/bwa.
About Intersil
Intersil is a leading supplier of semiconductors, reference designs and software for wireless access and communications analog markets. Intersil applies analog, mixed-signal and radio frequency (RF) expertise to products that enable wireless access to broadband media; provide reliable power management for PCs, files servers and portable information appliances; and convert analog and digital signals in cellular and Internet infrastructure. For more information about Intersil, visit the company's Internet homepage at www.intersil.com.
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